http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004277854-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ad78b36d08c20f06075145cc1caf3ac8
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24
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filingDate 2003-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_23c7a15f3bf75834ae6aa0a52e2a4f65
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a182b36ab21202ef393162d55616d367
publicationDate 2004-10-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2004277854-A
titleOfInvention Semi-additive etching agent, semi-additive method using the same, and method of manufacturing wiring board
abstract The present invention provides a semi-additive etching agent capable of maintaining a good circuit cross-sectional shape even for a fine circuit, a semi-additive method using the same, and a method for manufacturing a wiring board. A semi-additive etching agent having a pH of 13 or more and containing a metal ferricyanide salt, preferably potassium ferricyanide, and a chelating agent, preferably gluconic acid and / or a salt thereof. Forming a thin film layer of a chromium-containing material and a thin film layer of copper on an insulating base material to form a power supply film, forming a resist layer on the power supply film, and electroplating copper in an opening of the resist layer Forming a layer, removing the resist layer, removing the copper thin film layer of the power supply film with the first etchant, and removing the thin film layer of the chromium-containing material of the power supply film with the second etchant. And a removing step, wherein the semi-additive etching agent is used as the second etching agent. [Selection diagram] None
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009011026-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006245199-A
priorityDate 2003-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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