http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004273911-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_696ca0ae93d5cf5a686273601361781f
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00
filingDate 2003-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_22bccf4e7640f08285550ec8cbc42184
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f9f77b842866564444bd3a7ff66d2f8e
publicationDate 2004-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2004273911-A
titleOfInvention A method for manufacturing an ultrafine circuit printed wiring board.
abstract An object of the present invention is to obtain a printed wiring board having an ultrafine wire circuit having a line / space of 25/25 μm or less and excellent copper foil adhesion. As a copper foil of a copper-clad laminate having at least two or more copper layers, a matte surface with a carrier metal foil is omitted. After peeling off the carrier metal foil on the surface of the copper-clad laminate on which the copper foil of Rz2 to 4 μm is stuck, an extra-fine wire circuit is produced by a pattern plating method. The small-diameter hole is irradiated directly with a pulse energy of a carbon dioxide laser sufficient for processing a copper foil, preferably one energy selected from an energy of 3 to 19 mJ, onto the copper-clad laminate to form a blind via hole and / or through hole. Form a hole. [Effect] It is possible to form a small-diameter hole by directly irradiating a carbon dioxide gas laser without applying a copper foil surface treatment, and to obtain a printed wiring board having an excellent copper foil adhesive force and a very fine wire circuit with a good yield. Was completed.
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