http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004273576-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4edd4e526605dbd18b513b4b30d19ab2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_44eec329c4dd878adcf74358915345df |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-50 |
| filingDate | 2003-03-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8afdc7551b609507e03e9902205fff8c |
| publicationDate | 2004-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2004273576-A |
| titleOfInvention | Semiconductor device and method of manufacturing the same |
| abstract | A main object of the present invention is to provide a semiconductor device with improved reliability and a method for manufacturing the same. A semiconductor device of the present invention includes a semiconductor element, a conductive member electrically connected to the semiconductor element, a plating layer covering a surface of the conductive member, a semiconductor element and the conductive member. In the semiconductor device having the sealing resin 13 for sealing the metal, the plating layer 16 has a configuration made of a metal having a lower thermal conductivity than the conductive member. Therefore, it is possible to prevent a rapid rise in temperature of the sealing resin due to heat generation of the semiconductor element. [Selection diagram] Fig. 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9184115-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2013080759-A1 |
| priorityDate | 2003-03-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 23.