http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004269778-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G4-18 |
| filingDate | 2003-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f2089c63095c387b0b99c4f2f2b67a18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a164e6543a83b4877c835cb71839199f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4c740437a0714b3a7930281e8dd46178 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3e9d397f76a4c49f5458ac694343dd5e |
| publicationDate | 2004-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2004269778-A |
| titleOfInvention | the film |
| abstract | An object of the present invention is to provide a film having low hygroscopicity, high relative permittivity, low dielectric loss, and good moldability during manufacturing. The film of the present invention comprises a thermosetting resin comprising a polycarbodiimide having a structure represented by the following general formula (I), an inorganic material having a relative dielectric constant of 10 or more and an average particle size of 0.1 to 5 μm. Powder, and the amount of the inorganic powder is 3 to 34 vol%. Embedded image (In Formula I, R represents an organic diisocyanate residue, R 1 represents an organic monoisocyanate residue, and n represents an integer of 1 to 100.) [Selection diagram] None |
| priorityDate | 2003-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 71.