http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004266170-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d5d04736b0b882a4f5a1e0e0e4cd8cbb |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 |
| filingDate | 2003-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0f797d9ab4687b94a03acb7212fff0b0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_473d99b36d3da742baedeaba414d0fd8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bda2f754f5212a2e2fd4f4aba5c5d4e6 |
| publicationDate | 2004-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2004266170-A |
| titleOfInvention | Manufacturing method of laminate for printed wiring board |
| abstract | Provided is a method for manufacturing a novel laminate for a printed wiring board. The present invention provides a step (I) of applying a liquid resin composition (B) on an insulating substrate (A) having a conductive layer provided on at least one surface, and the step of applying the liquid resin composition (B). ) To form an intermediate layer (B ′) composed of a coating film of the resin composition (II), and a step (III) of attaching a dry film resist (C) on the intermediate layer (B ′). ), Wherein the liquid resin composition (B) contains water as a solvent, and relates to a method for manufacturing a laminate for a printed wiring board. [Selection diagram] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020017524-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2006123783-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8664534-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013048205-A |
| priorityDate | 2003-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 128.