http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004259941-A

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filingDate 2003-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_83efa53d57ba23cdba8bddf6bb16cfaf
publicationDate 2004-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2004259941-A
titleOfInvention Electronic device housing structure and heat dissipation method
abstract A sealed housing used for an electronic device such as a communication device dissipates heat while suppressing a change in internal pressure, prevents invasion of water vapor and harmful gas from the outside, and causes dew condensation and corrosion of electric circuit components. Prevent accidents caused by The closed housing includes a main body, a lid, and a movable fin. The movable fin is configured to respond to a change in the internal pressure of the closed housing due to a change in the internal temperature of the closed housing. It is configured so that the user can automatically move in and out of the housing. When the temperature inside the sealed housing increases due to heat generated from electric circuit components mounted on the package 4 inside the sealed housing. Since the heat radiation area of the movable fin 7 can be increased while maintaining the airtightness, the heat radiation effect can be improved. [Selection] Fig. 2
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010079404-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010219223-A
priorityDate 2003-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 22.