http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004253712-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f4a8faea375370b67c9d71e67db32bcd |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
| filingDate | 2003-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bdd5fa335fb8eae85787f7a70bc44471 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_03051c3b479f3b214e8a79290ca542ec |
| publicationDate | 2004-09-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2004253712-A |
| titleOfInvention | Wiring board |
| abstract | When connecting a connection pad of a wiring board to a terminal pad of an external circuit board via a conductor bump, a connection between the connection pads by a solder bridge due to a complicated warpage of the whole wiring board and an increase in the density of the connection pad. Electrical short circuit occurs. A wiring conductor is formed inside a quadrangular insulating base made of ceramics, and a large number of connection pads electrically connected to the wiring conductor are formed on a main surface of the insulating base in a rectangular area. The connection pads 3a located at the outermost corners of the arrangement of the connection pads 3 on the wiring board 4 formed in the array are formed on the main surface of the insulating base 1 such that the inner dimensions gradually increase from the opening to the bottom surface. Is formed on the bottom surface of the recess formed by the above, the difference in thermal expansion coefficient between the insulating base 1 of the wiring board 4 and the external electric circuit board over the connection pads 3 adjacent to the outer periphery of the insulating base 1 Can effectively reduce the stress generated. [Selection diagram] Fig. 1 |
| priorityDate | 2003-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 16.