| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1150d1d80ff7a4912c50ba531a56d6f2 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J11-16 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J11-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J11-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J11-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J11-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J11-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J11-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J11-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J11-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J11-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J11-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J11-12 |
| filingDate |
2003-02-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_87dd7e955ca91ab04bec750143c5dfec
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_15a4952841e07d0e4e24f61d91448cd4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_07494f7a384ed00a2c4f0c4236646291
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2f1549fffb0f235380618e1abb248edf |
| publicationDate |
2004-09-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2004247211-A |
| titleOfInvention |
Method of manufacturing thick film sheet electrode |
| abstract |
Provided is a method for manufacturing an electrode capable of suppressing substrate distortion and the like caused by heat treatment during electrode formation. Kind Code: A1 A dielectric printed layer and a conductor printed layer are formed on a substrate surface composed of a particle layer having a melting point higher than a sintering temperature of about 585 (° C.) of a thick film dielectric paste and a thick film conductor paste. Then, a heat treatment is performed at the sintering temperature to produce a thick film laminate, which is separated from the film forming surface and covered with a dielectric paste, and further heated at the sintering temperature of about 550 (° C.). By performing the heat treatment, a sheet member (thick film sheet electrode) in which the thick film laminate is covered with the dielectric film is obtained. Therefore, the particle layer that cannot be sintered at 585 (° C.) becomes a layer in which only high-melting particles are arranged by burning out the resin, and the generated sheet member is not fixed to the substrate. It can be used as a sustain electrode simply by being easily peeled off and fixed to the back plate. [Selection diagram] FIG. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7554267-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7812536-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7701414-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009016320-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008171790-A |
| priorityDate |
2003-02-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |