http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004244441-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_33dafb5bbc2ec47ebcb7becbbe60f704 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 2003-02-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2cfca7bb8f7a0dabfbc4278e65f73d48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ae3d45bbac5b80013dee053dae0a69bf http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e34f334e027f5c965fa9c76cceb3c2e0 |
| publicationDate | 2004-09-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2004244441-A |
| titleOfInvention | Thermosetting resin composition |
| abstract | An object of the present invention is to provide a thermosetting resin composition capable of relaxing internal stress without reducing heat resistance and having sufficient flexibility. The (A) epoxy resin, (B) curing agent, and (C) an epoxy group in the molecule in a range of 0.15 to 2 meq / g, and a number average molecular weight in a range of 20,000 to 200,000. A thermosetting resin composition containing an epoxidized polybutadiene. [Selection diagram] None |
| priorityDate | 2003-02-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 40.