| abstract |
A curable polyphenylene ether-based resin composition having excellent adhesive strength to a conductor, a high-density wiring board material and a wiring board using the same, which are suitable for high-frequency applications, are provided. A low dielectric constant excellent in adhesion to a conductor is obtained by using a composition containing a modified polyphenylene ether, a specific crosslinkable compound, and a hydrogenated product of a specific functional group-modified block copolymer. -A wiring board with low dielectric loss can be obtained. [Selection diagram] None |