http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004226204-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_73ebc284a55d5daf0e209d6186c9e65c
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-07342
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R3-00
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-073
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-067
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26
filingDate 2003-01-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_28996b008d1eaa8e22449cd03447ceb3
publicationDate 2004-08-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2004226204-A
titleOfInvention Probe card and method for manufacturing the same
abstract Provided is a probe card capable of reducing contact resistance by preventing an oxide film from adhering to a probe needle. The probe card includes a plurality of probes manufactured by coating a surface of a first conductive material with a second conductive material having a melting point lower than the melting point of the first conductive material. A plurality of probe needles, each of which is in contact with a plurality of bonding pads provided on the semiconductor wafer and electrically connects the semiconductor wafer and the tester; and a conductive pattern is formed to support the plurality of probe needles. An insulating substrate. [Selection diagram] FIG.
priorityDate 2003-01-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID104727
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419583196

Total number of triples: 18.