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filingDate 2004-01-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d41bc300b648b91acdb20e16f1f9112b
publicationDate 2004-08-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2004221590-A
titleOfInvention Tape package having test pad formed on back surface and inspection method therefor
abstract PROBLEM TO BE SOLVED: To provide a tape package in which a test pad is formed on a back surface and an inspection method thereof. SOLUTION: A test pad capable of increasing the compatibility of a probe card by unifying the shape of a test pad, increasing the pitch of the test pad, improving the accuracy during electrical inspection, and shortening the total length of the tape package. Is a tape package formed on the back. To this end, the present invention arranges test pads on the upper surface on the back surface of the base substrate through through holes in the base substrate. [Selection diagram] FIG.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102859371-B
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019079032-A
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020106861-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7342737-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7182397-B2
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