| abstract |
An object of the present invention is to reduce the size and weight of a multilayer wiring board and improve workability. A multilayer wiring board includes a substrate, a first conductor circuit (metal plating film), an insulating resin layer, and a second conductor circuit (metal plating) on at least one surface of the substrate. And a film 30). The insulating resin layer 20 is composed of a resin composition containing a benzocyclobutene resin, a particulate inorganic filler, and an ultraviolet absorber. [Selection diagram] Fig. 4 |