http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004221135-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0f705f295f4ba571f5311e5ef1b57807 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
| filingDate | 2003-01-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1aff136caea3f52a3d88762ae9dd2dd6 |
| publicationDate | 2004-08-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2004221135-A |
| titleOfInvention | Multilayer printed wiring board |
| abstract | An object of the present invention is to provide a multilayer printed wiring board having excellent electrical connectivity, in which a crack is prevented from being generated in an electrode pad group even when subjected to a drop impact. In a multilayer printed wiring board provided with an electrode pad group in which a plurality of pads electrically connected to an electronic component are densely formed, at least one pad located on the outer periphery of the electrode pad group is provided. And a via hole structure filled with a conductor. [Selection diagram] Fig. 4 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015076566-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102582537-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20180048576-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017038713-A1 |
| priorityDate | 2003-01-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 61.