http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004207640-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| filingDate | 2002-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_95eebf73dcd182ed073d4dbbf7dd20b6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d76c7f825257fa8cdb08ab406f39ae16 |
| publicationDate | 2004-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2004207640-A |
| titleOfInvention | Method of forming plated through hole |
| abstract | When a porous film is used as an insulating layer of a wiring board, a plating layer can be suitably formed, and a plating through-hole forming method which is less likely to cause a problem due to entry and remaining of a plating solution and a method formed by the method. Provided is a wiring board having a plated through hole. A plating through hole includes a step of forming a through hole by drilling in a laminate having at least one resin porous layer, and a step of forming a plating layer at least on an inner periphery of the through hole. Is characterized in that a dense layer 12a in which the resin porous layer 12 is densified is formed on the inner periphery of the through hole H1 by the drilling. [Selection diagram] Fig. 1 |
| priorityDate | 2002-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 49.