http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004200415-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f4a8faea375370b67c9d71e67db32bcd |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-49171 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
| filingDate | 2002-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_baf61ede0bee8d79edccaeb612d50194 |
| publicationDate | 2004-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2004200415-A |
| titleOfInvention | Wiring board |
| abstract | A wiring board cannot be firmly joined to an external electric circuit board due to the rise of solder. An insulating substrate having an electronic component mounting portion and a frame-shaped metal layer surrounding the mounting portion on an upper surface, and having connection pads on an outer peripheral portion of a lower surface, and the connection on a side surface of the insulating substrate. A wiring board provided with a pad and a frame-shaped metal layer connected to each other, and having a groove-shaped recess formed on an inner wall surface of which a conductor is attached; A small-diameter portion 5b having an inner diameter smaller than that of the other portion is formed in a part of the insulating substrate 1, and the connection pad 4 is formed toward a center of a lower surface of the insulating base 1. [Selection diagram] Fig. 1 |
| priorityDate | 2002-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 18.