| abstract |
An object of the present invention is to provide a resin-cured material which is liquid at room temperature (25 ° C.) and has a low viscosity, so that it is excellent in workability such as casting, and after curing, becomes a resin cured product having excellent heat resistance, particularly excellent mechanical properties at high temperatures. Provided are an adhesive made of a resin composition and a semiconductor device using the same. An epoxy resin (a) and the following general formula 1 Embedded image (Where R is an organic group containing a functional group that causes an addition reaction with the epoxy resin, and R ′ is a methyl group or an ethyl group) and water (b), And the following general formula 2 Embedded image (Wherein A represents a divalent organic group having at least two carbon atoms) (c) and a curing agent (d) using a thermosetting resin composition as an essential component adhesive. [Selection diagram] Fig. 1 |