http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004196889-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_00d9474213f1cfc11cef22681cf0f69a |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J3-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-04 |
| filingDate | 2002-12-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_af00715f34be9187344632ef7ad7545c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fceae9001f3b9bba444f9015b6e7c3d4 |
| publicationDate | 2004-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2004196889-A |
| titleOfInvention | Method for producing resin particles and method for producing anisotropic conductive adhesive |
| abstract | An object of the present invention is to provide a technique for producing resin particles which have high strength and are not destroyed even when subjected to large compression deformation. The method for producing resin particles according to the present invention comprises heating a raw material liquid containing a radically polymerizable substance and a polymerization initiator at a temperature of not more than a half hour temperature of the polymerization initiator for 10 hours. To cure. Since the resin particles 30 produced according to the present invention have a high strength of 1200 Pa or more, they are not broken even if they are greatly deformed so that the compressive deformation rate becomes 60% or more. Therefore, when the connection terminals 43 and 47 are connected using an anisotropic conductive adhesive film 39 in which conductive particles 37 having a conductive layer 36 formed on the surface of the resin particles 30 are dispersed in an adhesive material 38, the connection terminals Since the conductive particles 37 sandwiched between 43 and 47 are greatly deformed, the contact area between the connection terminals 43 and 47 and the conductive particles 37 increases, and the conduction resistance value decreases. [Selection diagram] FIG. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8519549-B2 |
| priorityDate | 2002-12-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 111.