http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004193517-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_73ebc284a55d5daf0e209d6186c9e65c |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
| filingDate | 2002-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0342c0f8492d756a75d4b2b63db45523 |
| publicationDate | 2004-07-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2004193517-A |
| titleOfInvention | Semiconductor chip, semiconductor chip manufacturing method, semiconductor mounting substrate, electronic device, and electronic apparatus |
| abstract | A semiconductor chip capable of preventing the occurrence of migration, a manufacturing method thereof, a highly reliable semiconductor mounting substrate, an electronic device, and an electronic apparatus including the same are provided. A semiconductor chip according to the present invention has a gap between a substrate on which a wiring pattern is formed, a plurality of terminals provided so as to be in contact with a part of the wiring pattern, and adjacent terminals. And a resin layer 8 provided so as to be buried and lower than the height of the terminal 3. It is preferable that 10 to 90% of the height of the terminal 3 is exposed from the resin layer 8, and it is preferable that the cross-sectional area is substantially constant along the thickness direction. The terminal 3 is composed of a laminate of a plurality of metal layers 31, 32, 33, and the metal layer 31 located closest to the substrate 2 among the plurality of metal layers is mainly composed of Ni or an alloy containing Ni. It is preferably made of metal. [Selection] Figure 4 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009505386-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006278976-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010045234-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014093324-A |
| priorityDate | 2002-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 30.