| abstract |
An object of the present invention is to improve the adhesion between an overcoat resin and a sealing resin layer by irradiating the overcoat resin formed on a conductive wiring layer with plasma. A first conductive film and a second conductive film which are stacked with an interlayer insulating layer interposed therebetween are provided. By selectively removing the first conductive film, a first conductive wiring layer 12A is formed, and the first conductive wiring layer is covered with an overcoat resin 18. The surface of the overcoat resin 18 is roughened by irradiating it with plasma. The sealing resin layer 17 is formed so as to cover the roughened surface of the overcoat resin 18 and the circuit element 13. [Selection diagram] FIG. |