http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004186281-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c1755eede76ea7e719a3e0d2843cd793 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-68 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J5-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301 |
| filingDate | 2002-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5b54196c18392457dc4984d7eb5aef80 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6f9fbc08f172810e4d363236511b898d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a49153df6022aaaf18d0957093a87ca7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f25ecd782c46789a0c771c686e04c26b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_97b5d9834cc3c21bebcd7ff124f283bd |
| publicationDate | 2004-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2004186281-A |
| titleOfInvention | IC chip manufacturing method |
| abstract | Provided is a method for manufacturing an IC chip that can prevent breakage of the wafer even if the wafer is extremely thin, improve the handleability, and can process the IC chip satisfactorily. A step of fixing a wafer to a transparent support plate via a support tape formed from an adhesive sheet that generates gas from at least one surface by light stimulation, wherein the wafer is fixed to the transparent support plate. A method for manufacturing an IC chip, comprising a step of processing and a step of irradiating the support tape with light from the transparent support plate side and separating the support tape from the wafer, the step of fixing the wafer to the transparent support plate via the support tape. In the step of bonding the surface of the pressure-sensitive adhesive sheet, which generates gas by light stimulation, to the wafer, and irradiating the support tape with light from the transparent support plate side to peel the support tape from the wafer, the outer peripheral portion of the support tape is bonded. A method of manufacturing an IC chip in which an adhesive surface is peeled near a center before a surface is peeled. [Selection diagram] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010205807-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006160954-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-100383929-C |
| priorityDate | 2002-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 94.