http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004182825-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-5419 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 2002-12-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_76196f0f9ef064d3c70f844d98b2fb6b |
| publicationDate | 2004-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2004182825-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | The present invention provides an epoxy resin composition for semiconductor encapsulation having excellent fluidity and solder resistance. An essential component is (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) an inorganic filler, and (E) a silicone oil represented by the general formula (1). An epoxy resin composition for semiconductor encapsulation, comprising: Embedded image (In the formula, m and n are average values, 0 ≦ m ≦ 7, 1 ≦ n ≦ 8, 1 ≦ m + n ≦ 8. R 1 to R 8 are organic groups having 1 to 10 carbon atoms. Ra , Rb Each represents an organic group having 1 to 30 carbon atoms, and the total number of carbon atoms of R a and R b is 2 to 40. Each of R a , R b , and R 1 to R 8 has a hydroxyl group, a carboxyl group, or an ether bond. Carbon number / oxygen number ≧ 4) |
| priorityDate | 2002-12-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 46.