| abstract |
A conductive adhesive for forming a coating film for binding a conductive filler with an organic binder, and a conductive paste of a conductive coating material, the conductivity of which is improved without increasing the content of the conductive filler. A conductive paste containing (A) a resin, (C) a diluent, (D) a sublimable organic compound, and (E) a conductive filler. A conductive paste further containing (B) a curing agent, and using a thermosetting resin or an active energy curable resin as the component (A). Electronic circuit products using the conductive paste. [Selection diagram] None |