| abstract |
The photocurable composition of the present invention comprises (A) a carbon cluster and / or a derivative thereof having a photosensitizing effect, (B) a compound having a plurality of heterocycles in a molecule, and Accordingly, (C) a non-photosensitive resin is contained. Such a photocurable composition of the present invention also preferably contains a compound having a siloxane bond in the molecule. According to the present invention, a light which can be suitably used as a negative photoresist composition, can form a fine pattern with high sensitivity characteristics, and can produce a cured film having excellent heat resistance, chemical resistance and insulation properties. A curable composition can be provided. When the photocurable composition of the present invention is used, a photosensitive insulating film used in the production of semiconductor devices and liquid crystal devices, and in the field of mounting each device can be produced with a small heat history / light irradiation history. . [Selection diagram] None |