| abstract |
An object of the present invention is to provide a method of manufacturing a semiconductor integrated device which can prevent corrosion of an external wiring on a side surface of an element. A step of forming an integrated circuit element on a semiconductor substrate, a step of forming an internal wiring, and forming a groove exposing a part of the internal wiring along a scribe line on a back surface of the semiconductor substrate. Forming a metal film covering at least the groove, patterning the metal film to form the external wiring 18, and removing the metal film at the bottom of the groove; And a step of dividing the semiconductor substrate 10 along a scribe line. [Selection diagram] FIG. |