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filingDate 2002-11-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_20072b464fe972dcc894507f394a4b37
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publicationDate 2004-06-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2004158798-A
titleOfInvention Adhesive tape for semiconductor device
abstract An adhesive tape for a semiconductor device having excellent wire bonding properties is provided. The adhesive tape for a semiconductor device has a thermosetting adhesive layer formed on at least one surface of an insulating film, and has a reciprocal of a thickness of the thermosetting adhesive layer and a thermosetting adhesive after thermosetting. An adhesive tape for a semiconductor device, wherein the product of the agent layer and the loss modulus at 200 ° C. is larger than 0.25 MPa / μm. [Selection diagram] None
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