http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004158740-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_696ca0ae93d5cf5a686273601361781f |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K101-42 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-382 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| filingDate | 2002-11-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_22bccf4e7640f08285550ec8cbc42184 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c53f3eeb39ac652f39a096838417f474 |
| publicationDate | 2004-06-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2004158740-A |
| titleOfInvention | A hole forming method using a carbon dioxide laser with excellent hole diameter accuracy in an additive substrate. |
| abstract | A laser drilling method with excellent hole diameter accuracy in a (semi) additive substrate and excellent hole reliability is obtained. In a method of forming a hole in a (semi) additive substrate, after the surface is roughened, the plating is deposited to a thickness of 0.1 to 5 μm, and from this surface, energy sufficient to process the copper foil is obtained. The laser beam is directly irradiated to form blind via holes and / or through holes. [Effects] By drilling in this step, the shapes of the holes on the entry side and the bottom or exit side can be made substantially the same, and a printed wiring board excellent in reliability and the like can be obtained. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I643895-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014131072-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101906687-B1 |
| priorityDate | 2002-11-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 62.