| abstract |
A wiring board which can be fired at 1050 ° C. or lower, can form a wiring layer containing a low-resistance metal by simultaneous firing, and has high mounting reliability. SOLUTION: In wiring board comprising an insulating substrate and a wiring layer, at least as insulating substrate, SiO 2 30 to 55 wt%, Al 2 O 3 15~40 wt%, MgO 3 to 25 wt%, ZnO 2 15 wt%, B 2 O 3 glass powder 60 to 99 wt% containing 2 to 15 wt%, mullite, anorthite, Surausonaito, celsian, at least one filler powder 1 selected from the group of quartz glass A glass-ceramic sintered body obtained by mixing and shaping with 40% by mass and firing at a temperature of 1050 ° C. or lower in the air or a nitrogen atmosphere is used. [Selection diagram] Fig. 1 |