| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0f705f295f4ba571f5311e5ef1b57807 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate |
2002-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f658afa79619e646e1226310268f9eb7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_840c9af28dd1fb180afe92dd8c9415d0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b156fccee8ca1b23d6e152d59de4b812 |
| publicationDate |
2004-05-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2004140216-A |
| titleOfInvention |
Multilayer printed wiring board and method of manufacturing the same |
| abstract |
An object of the present invention is to provide a multilayer printed wiring board that does not reduce electrical connectivity and connection reliability by using a core substrate made of a metal plate. A through hole (32) of a core substrate (30) is filled with a resin (36) to form a through hole (41). Since the corner of the opening of the through hole 32A of the metal plate 30A is covered with the metal layer 34 and the corner is not in contact with the resin 36 side, stress concentration at the opening of the through hole 32 is reduced even in the heat cycle test. There is no crack in the resin 36. [Selection] Fig. 8 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013122961-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8178791-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9420708-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008173654-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8772646-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009147060-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010050154-A |
| priorityDate |
2002-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |