| abstract |
An object of the present invention is to provide a photosensitive resin composition for a solder resist having good adhesion, excellent acid resistance, excellent plating resistance, and not inferior in other coating film properties, and a printed wiring board using the same. An active energy ray-curable resin having at least two ethylenically unsaturated bonds in one molecule, (B) a polybutadiene-based polymer compound, (C) a photopolymerization initiator, and (D) dilution Resin composition containing an agent and (E) a thermosetting compound. A printed wiring board using the composition. [Selection diagram] None |