| abstract |
Provided is an adhesive aid composition having excellent adhesive strength to a polyimide film or the like without deteriorating mechanical properties and useful in the field of electric materials. [Solution] The following equation (1) Embedded image (In the formula (1), R 1 represents a divalent aromatic group, n represents an average number of substituents and represents a positive number of 1 to 4), and a phenolic hydroxyl group-containing polyamide having a segment represented by An adhesive aid composition containing a solvent and a film obtained by applying the adhesive aid composition to a polyimide precursor. |