http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004134783-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_24aca9ded2638ea793d05360dde7a4a0 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
| filingDate | 2003-09-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0753218c46835e9b576fdafda491dba6 |
| publicationDate | 2004-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2004134783-A |
| titleOfInvention | Cleaning solution for semiconductor substrate and method for manufacturing semiconductor device |
| abstract | 【Task】 Using a cleaning liquid for a semiconductor substrate and a cleaning liquid which can remove abrasive grains such as silica and alumina and copper polishing debris while suppressing corrosion of copper wiring, and have little organic residue on the surface of the copper wiring after cleaning. It is an object to provide a method for manufacturing a semiconductor device. [Solution] Provided is a method for manufacturing a semiconductor device, comprising: a cleaning liquid for a semiconductor substrate having a copper wiring containing a saccharide and a basic compound; and a step of cleaning the semiconductor substrate having the copper wiring with the cleaning liquid. [Selection diagram] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014088526-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2011123442-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006253633-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021020410-A1 |
| priorityDate | 2002-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 115.