http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004128112-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36d1d9c59848bff6ad5f55923d1290f5 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
| filingDate | 2002-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_129b87cf7fe85f3c171093aee7808033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b2406775c61766085678984bf0f85669 |
| publicationDate | 2004-04-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2004128112-A |
| titleOfInvention | Method for manufacturing semiconductor device |
| abstract | [Problem] In flattening a copper wiring, dishing or erosion occurs, and there is a problem such as a decrease in yield due to an increase in variation in wiring resistance value after flattening, a short circuit due to unpolished copper, and the like. A polishing liquid comprising an oxidizing agent, an organic acid, an anticorrosive, a surfactant, and pure water, a polishing pad, a fixed abrasive disk, and a dresser capable of dressing the surface of a polishing tool are provided. A polishing liquid for high-speed polishing is supplied to a polishing pad for polishing, and in the middle stage of processing, a polishing liquid having a high unevenness selectivity is supplied to a fixed abrasive disk to polish the residual step of copper, and polishing is performed. The problem can be solved by switching the polishing liquid so that the copper and the barrier film can be polished at almost the same speed immediately before or immediately after the exposure, and driving the dresser to perform conditioning during the processing. [Selection diagram] Fig. 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009056102-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009516928-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007129115-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8991042-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8286344-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103646866-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013012019-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008507855-A |
| priorityDate | 2002-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 42.