| abstract |
[PROBLEMS] It is not necessary to heat a bump to a melting temperature, and it is possible to perform mounting at a lower temperature, with a higher yield and with higher reliability, thereby improving the throughput of electronic component mounting and improving bonding efficiency. Provided are a bonding method, a bonding stage, and an electronic component mounting apparatus that can be improved. An electronic component is connected to a substrate via bumps, and the electronic component is mounted on the substrate. The surface of the substrate 74 on which the electronic component is mounted, the surface of the electronic component 76 connected to the substrate 74, and the surface of the bump 77 are subjected to plasma processing, and then the bump 77 is heated at a temperature lower than its melting point. At the same time, the substrate 74 and the electronic component 76 are pressure-bonded via the bumps 77. [Selection diagram] FIG. |