http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004114561-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
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filingDate 2002-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5c37617a935280e521bc8a0e2185ad8c
publicationDate 2004-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2004114561-A
titleOfInvention Method for producing thermosetting resin composition epoxy resin molding material and semiconductor device
abstract An object of the present invention is to provide a method for producing an epoxy resin molding material in which bubbles are uniformly dispersed. SOLUTION: A) An epoxy resin, (B) a phenolic resin, (C) a curing accelerator and (D) an inorganic filler are essential components, a step of mixing the above components with a mixer, and heating and melting with a hot roll. Production of an epoxy resin molding material for semiconductor encapsulation, comprising a first step of obtaining a heated melt by heating, and a second step of subsequently heating and melting the heated melt with a hot roll at a shear rate of 40 / s or less. Method.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016506881-A
priorityDate 2002-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 26.