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filingDate 2002-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8490301dd6b3929fb117db24499b9666
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publicationDate 2004-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2004114123-A
titleOfInvention Solder-coated ball, method of manufacturing the same, and method of forming semiconductor connection structure
abstract An object of the present invention is to provide a solder-coated ball having an Sn-Ag-based solder layer, in which generation of voids during heating and melting is suppressed, and a method of manufacturing the same. A solder-coated ball (50) according to the present invention has a ball-shaped core (2) and a solder layer (4) containing Sn and Ag provided so as to surround the core (2). The amount is 100 μl / g or less in the standard amount of water vapor. [Selection diagram] Fig. 1
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7951463-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010099736-A
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9610655-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2016171526-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4653406-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2016171525-A1
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