http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004111769-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f4a8faea375370b67c9d71e67db32bcd
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
filingDate 2002-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1525e671b211496c6125ab21def37d31
publicationDate 2004-04-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2004111769-A
titleOfInvention Substrate for mounting electronic components
abstract An object of the present invention is to improve mechanical strength around a through conductor and ensure insulation between a land of a multilayer capacitor portion and a conductor layer. A first through conductor (10a) formed from a wiring conductor (5) to an electrode pad (11) penetrating a multilayer capacitor portion (7) inside a base (1), and inner power conductor layers of the multilayer capacitor portion (7) or an inner ground conductor layer (7). And a second through conductor 10b connecting the first and second through conductors 10a and 10b, and the first and second through conductors 10a and 10b are provided at portions that penetrate or connect to the inner power conductor layer or the inner ground conductor layer. A land 12 made of a conductor layer independent of the inner power conductor layer or the inner ground conductor layer is provided by the conductor non-forming portion 13 concentrically surrounding the portion, and penetrates the adjacent inner ground conductor layer or inner power conductor layer. An auxiliary insulating layer 14 facing the land 12 and the non-conductor-formed portion 13 is provided at a portion connected to them. [Selection diagram] Fig. 1
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007189058-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4613828-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4613846-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8134081-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7307161-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019129240-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8809693-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007208027-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7012543-B2
priorityDate 2002-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID6336543

Total number of triples: 24.