| abstract |
[PROBLEMS] To provide a conductive composition for electrical connection of an electronic device having high fluidity, excellent coating properties, printability and filling properties, and excellent electrical conductivity and durability by applying energy such as heat treatment. A metal-containing composition is provided. As a constituent element of a metal-containing composition for electrical connection of an electronic device, a metal particle powder having an average particle size of 20 nm or less, a metal particle powder having an average particle size of 50 nm or more and 2000 nm or less, and a resin, depending on circumstances. Furthermore, the electroconductive particle powder whose average particle diameter exceeds 2000 nm and is 20 micrometers or less is included. [Selection figure] None |