| abstract |
An object of the present invention is to provide a composite structure in which a metal is dispersed in ceramics to exhibit conductivity. A structure in which at least one kind of metal is dispersed in one or more kinds of insulators or ceramics as a semiconductor to exhibit conductivity is directly bonded to a base material. Specifically, the lower side of the photograph is a silicon substrate, the upper side is a structure in which nickel is dispersed in aluminum oxide, and the whitish portion in the structure is nickel. [Selection diagram] FIG. |