http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004104117-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H03H9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-10
filingDate 2003-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7819630aa3576ff5aff8dc778d0f1515
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_db1a275bfb7983e48d6369204d8dc714
publicationDate 2004-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2004104117-A
titleOfInvention Electronic component package and piezoelectric vibration device using the package
abstract PROBLEM TO BE SOLVED: To provide a low-cost electronic component and a piezoelectric vibrating device having a hermetic sealing structure that improves the reliability of hermetic sealing joining of a package and a cap and also has environmental stability, and that has stable characteristics. The purpose is to: SOLUTION: The surface mount type crystal unit is bonded to a ceramic package 1 having a concave portion with an open top, a crystal plate 3 as a piezoelectric vibration plate housed in the package, and an opening of the package. Cap 2. The cap and the package were hermetically bonded with a tin phosphate glass bonding material. [Selection diagram] Fig. 1
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012074837-A
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010088064-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011160115-A
priorityDate 2002-08-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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