| abstract |
A thin film circuit board having high resistance to bending stress is provided. A resin substrate 3, a thin film transistor 1a provided on the resin substrate 3, a wiring 11 connected to the thin film transistor 1a, and an island pattern covering the thin film transistor 1a are provided on the resin substrate 3. And an inorganic insulating film 13 and a resin film 15 provided on the resin substrate 3 so as to cover the wiring 11 and the inorganic insulating film 13. The thin film transistor 1a includes a semiconductor layer 9 provided on a resin substrate 3 with a gate electrode 5 and a gate insulating film 7 interposed therebetween, and the inorganic insulating film layer constituting the gate insulating film 5 connects the semiconductor layer 9 from the resin substrate 3 side. Patterned to cover islands. [Selection] Figure 1 |