| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36f8253f3d0d59bcd9259217d4385d10 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31678
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31721
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31504
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31681 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G69-265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G69-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G69-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G69-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G69-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-22 |
| filingDate |
2003-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bb51ecc6250cd828e37570304f15e190
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b89382ad820940766579e7cab01f6d58
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d2cbfe922f4fa2f1a2ed0b0ed1291875
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d440c6d380e416edcd676e74b15de362
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_74ce767632953a29117a592b955930c8 |
| publicationDate |
2004-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2004099873-A |
| titleOfInvention |
Insulation materials for aluminum and copper metallization |
| abstract |
The present invention relates to a dielectric for metallizing aluminum and copper which is stable at high temperatures. The poly-o-hydroxyamide is prepared by reacting a bis-o-aminophenol with a dicarboxylic acid or an activated derivative thereof (acid chloride). Further, the poly-o-hydroxyamide is dehydrated and cyclized by heating to obtain polybenzoxazole. Surprisingly-despite being dehydrated during cyclization-dielectrics of this polymer composition are very suitable for filling narrow trenches. The filled trench has no defects and no bubbles or cracks. Polybenzoxazole has a low dielectric constant (≦ 2.7) and is suitable as an electrical insulator. In addition, this material adheres very well to all microelectronic optics surfaces. [Selection diagram] None |
| priorityDate |
2002-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |