| abstract |
An object of the present invention is to provide a photo-curing material which is highly sensitive and has excellent bending resistance, bending resistance, flexibility, plating resistance, heat resistance, and electrical characteristics required for a solder resist used for a flexible printed wiring board or TAB tape. Provided is a thermosetting resin composition. The photo-curable / thermo-curable resin composition of the present invention comprises (A) reacting a linear polyfunctional epoxy compound having a specific structure with an unsaturated monocarboxylic acid, and then preparing a polybasic acid anhydride. A carboxyl group-containing photocurable resin obtained by reaction, (B) an alkylene oxide is added to a compound having three or more phenolic hydroxyl groups in one molecule, and the resulting alcoholic hydroxyl group is partially unsaturated. Carboxyl group-containing photocurable resin obtained by esterification with monocarboxylic acid and further adding polybasic acid anhydride to unreacted alcoholic hydroxyl group, (C) photopolymerization initiator, (D) 2 per molecule It contains an epoxy resin having at least two epoxy groups, and (E) a diluent. [Selection diagram] None |