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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-308
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027
filingDate 2002-09-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5ca8a5136dddb6db7fba6eb6c74ef26e
publicationDate 2004-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2004094034-A
titleOfInvention Release agent composition
abstract An object of the present invention is to provide an excellent peeling property for a deposit generated after ashing and prevent the deposit from being re-attached, cause less corrosion to a wiring material, and form a precipitate due to crystallization even during low-temperature storage, and the peeling performance caused by the crystallization. Provided is a release agent composition capable of obtaining stable properties and releasability without a decrease in the quality of the release agent, and a method for cleaning a semiconductor substrate or a semiconductor element using the release agent composition. A release agent composition containing 0.5 to 5% by weight of a polyvalent carboxylate, 1 to 18% by weight of a glycol ether, and 77 to 98.5% by weight of water. And a step of stripping and cleaning a semiconductor substrate or a semiconductor element using the stripping composition, the stripping composition comprising 1 to 18% by weight of glycol ether and 77 to 98.5% by weight of water. A method for cleaning a semiconductor substrate or a semiconductor element, comprising: [Selection diagram] None
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11091726-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101005925-B1
priorityDate 2002-09-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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