http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004087966-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5d7576285d411d00c697e07270d2814a
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01C7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01C17-06
filingDate 2002-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_53960a499538bad7a1221af465a908a1
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publicationDate 2004-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2004087966-A
titleOfInvention Dielectric substrate with resistive film and method of manufacturing the same
abstract An object of the present invention is to provide a dielectric substrate with a resistive film, which is formed as a high-frequency circuit, has small variations in thickness and shape, and has good precision in the obtained resistance value, and a method for manufacturing the same. A copper foil line is formed on a dielectric substrate, and the copper foil line has a slit portion. A film serving as a resistance element on the high-frequency circuit is formed in the slit. First, a conductive resin coat film 3 is formed on the dielectric substrate 1 and the copper foil line 2. Next, the conductive resin coat film 3 is exposed to ultraviolet light 6 from an ultraviolet lamp 5 via the mask 4. After exposure, a resistive film is obtained by developing. [Selection diagram] Fig. 1
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priorityDate 2002-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 28.