| abstract |
A method for manufacturing a wafer-level flip-chip device capable of sealing protection between a chip and an interposer, and for semiconductor mounting excellent in cleaning property when repairing a semiconductor chip by re-melting, and also excellent in heat resistance. A reinforcing composition is provided. A bump on a silicon chip and a pad of an interposer are melt-bonded, and a reinforcing composition using a thermosetting resin that can be reflowed by heating is reflowed to fill a gap between the two. Wafer-level flip-chip device manufacturing method having one or more processes, one or two or more specific aromatic bifunctional epoxy compounds, one or more specific aromatic bifunctional phenol compounds, and a phosphorus-based catalyst A reinforcing composition comprising one or more compounds of the formula (I), wherein the molar ratio of the epoxy component to the phenol component is from 0.8 / 1 to 1.2 / 1. [Selection diagram] None |