http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004087821-A

Outgoing Links

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ac8ea4f652c51209833279712f81831b
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-14
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L47-02
filingDate 2002-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a82476ea9f4d453fda82cf25eb13b293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3a17bee0e0bba065cad71b33b1dfba81
publicationDate 2004-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2004087821-A
titleOfInvention Gunn diode and Gunn diode oscillator
abstract Disclosed are a Gunn diode and a Gunn diode oscillator that do not cause variations in oscillation frequency, oscillation output, and the like even when using a thermal and ultrasonic bonding tool. When configuring a Gunn diode oscillator in which a Gunn diode is connected to a semi-insulating flat plate substrate having a signal line and surface ground electrodes disposed on both sides of the signal line, a bump electrode of the Gunn diode is used. The structure is such that it is disposed on the peripheral insulating region, avoiding directly above the active layer partitioned by the insulating region. [Selection] Figure 1
priorityDate 2002-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 18.