| abstract |
An insulating material for a high-frequency wiring board, which makes it easy to design a circuit for matching characteristic impedance while taking advantage of the use of a resin porous film having a low dielectric constant as an insulating layer, and comprising the insulating material as an insulating layer Provided are a metal foil laminate and a high-frequency wiring board. An adhesive layer is formed on at least one surface of a resin porous layer, and a difference between a dielectric constant of the resin porous layer at 10 GHz and a dielectric constant of the adhesive layer at 10 GHz is zero. An insulating material for a high-frequency wiring board, which is not more than 4. [Selection] Fig. 2 |