abstract |
Provided is a sealant resin composition that can prevent underfill cracking and peeling from a substrate when used in combination with flip chip bonding. A sealant resin composition containing (A) an epoxy resin, (B) a curing agent for an epoxy resin, (C) an elastomer, and (D) a surfactant is used in combination with flip chip bonding. [Selection diagram] None |