http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004071824-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eedd2a00c4d0ba56ecf05fb4b97592dd
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
filingDate 2002-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_57003384f6b234c192e0cc572ca914ab
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_da1ac94bd4b2a0f0956ed03d835a39ac
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publicationDate 2004-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2004071824-A
titleOfInvention Manufacturing method of multilayer printed wiring board
abstract An object of the present invention is to provide a method of manufacturing a multilayer printed wiring board that can be manufactured with good productivity, good workability, and low cost without performing a roughening step of consuming a large amount of a chemical having a large burden on the environment. A method for producing a multilayer printed wiring board according to the present invention comprises a resin composition containing (A) an epoxy resin, (B) an epoxy resin curing agent, and (C) an organic solvent having a boiling point of 100 ° C. or higher as essential components. Is applied sequentially by screen printing to both sides of the inner circuit board on which the circuit is formed, and the obtained coating film is simultaneously dried on both sides. The method is characterized by at least passing through a step of integrally molding under pressure or under pressure using a plate press machine under vacuum or normal pressure. [Selection diagram] None
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104168717-A
priorityDate 2002-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 44.